Electrical cables from the junction box convey the current produced by the module to an adjacent module or to the system’s power electronics. The whole stack of materials is laminated in an oven to make the module waterproof, then fitted with an aluminum frame, edge sealant, and a junction box in which the ribbons are connected to diodes that prevent any backward flow of electricity. A second sheet of encapsulant is placed on top of the face-down cells, followed by a tough polymer backsheet or another piece of glass. The interconnected set of cells is arranged face-down on a sheet of glass covered with a sheet of polymer encapsulant. Module Assembly – At a module assembly facility, copper ribbons plated with solder connect the silver busbars on the front surface of one cell to the rear surface of an adjacent cell in a process known as tabbing and stringing. Screen printing of silver metallization for electrical contacts is also very common among cell types. Most cell types require the wafer to be exposed to a gas containing an electrically active dopant, and coating the surfaces of the wafer with layers that improve the performance of the cell. The subsequent processes vary significantly depending on device architecture. The first step is chemical texturing of the wafer surface, which removes saw damage and increases how much light gets into the wafer when it is exposed to sunlight.
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